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DATA SHEET
CX77112 PA Module for CDMA PCS (1850-1910 MHz)
Applications
* Personal Communications Services (PCS) * Wireless Local Loop (WLL)
Description
The CX77112 Power Amplifier Module (PAM) is a fully matched 10-pin surface mount module developed for Personal Communications Service (PCS) and Wireless Local Loop (WLL) applications. This small and efficient Power Amplifier packs full 1850-1910 MHz bandwidth coverage into a single compact package. The CX77112 meets the stringent spectral linearity requirements of Code Division Multiple Access (CDMA) PCS transmission, with high power added efficiency for power output of up to 29 dBm. A low current (VCONT) pin is provided to improve efficiency for the low RF power range of operation. The single Gallium Arsenide (GaAs) Microwave Monolithic Integrated Circuit (MMIC) contains all active circuitry in the module. The MMIC contains on-board bias circuitry, as well as input and interstage matching circuits. Output match is realized off-chip within the module package to optimize efficiency and power performance into a 50 load. This device is manufactured with Skyworks' GaAs Heterojunction Bipolar Transistor (HBT) process that provides for all positive voltage DC supply operation while maintaining high efficiency and good linearity. Primary bias to the CX77112 is supplied directly from a three-cell Ni-Cd, a single-cell Li-Ion, or other suitable battery with an output in the 3 to 4 volt range. Power down is accomplished by setting the voltage on the low current reference pin to zero volts. No external supply side switch is needed as typical "off" leakage is a few microamperes with full primary voltage supplied from the battery.
Features
* Low voltage positive bias supply - 3.2 V to 4.2 V * Low VREF - 2.85 V, nominal * Good linearity * High efficiency * Large dynamic range * 10-pin package - 4 mm x 4 mm x 1.5 mm * Power down control * Low power-state control * InGaP * IS95/CDMA2000 * Full U.S. PCS coverage
Figure 1. Functional Block Diagram
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DATA SHEET * CX77112
PA MODULE FOR CDMA PCS (1850-1910 MHZ)
Electrical Specifications
The following tables list the electrical characteristics of the CX77112 Power Amplifier Module. Table 1 lists the absolute maximum ratings, while Table 2 shows the recommended operating conditions to achieve the performance characteristics listed in Table 4. Table 3 presents a truth table for the power ranges.
Table 1. Absolute Maximum Ratings (1)
Parameter RF Input Power Supply Voltage Reference Voltage Case Operating Temperature Storage Temperature PIN VCC VREF TC TSTG Symbol Minimum -- -- -- -30 -55 Nominal 1.0 3.4 2.85 25 -- Maximum 6.0 6.0 3.1 +110 +125 Unit dBm Volts Volts C C
(1) No damage assuming only one parameter is set at limit at a time with all other parameters set at nominal value.
Table 2. Recommended Operating Conditions
Parameter Symbol VCC VREF Low Power Mode High Power Mode Operating Frequency Operating Temperature VCONT VCONT FO TO Minimum 3.2 2.75 2.0 0.0 1850.0 -30 Nominal 3.4 2.85 2.5 0.5 1880.0 +25 Maximum 4.2 2.95 3.0 1.0 1910.0 +85 Unit Volts Volts Volts Volts MHz C
Supply Voltage Reference Voltage Control voltage
Table 3. Power Range Truth Table
VREF High Power Low Power Shut Down 2.85 V 2.85 V 0.00 V VCONT 0.5 V 2.5 V 0.0 V Range 16 dBm to 29 dBm 16 dBm --
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PA MODULE FOR CDMA PCS (1850-1910 MHZ)
DATA SHEET * CX77112
Table 4. Electrical Specifications for CDMA Nominal Operating Conditions (1)
Characteristics Symbol GLOW Gain conditions Digital Mode GHIGH PAELOW Power Added Efficiency Digital Mode PAEHIGH Total Supply current Quiescent current Reference current Control current Total Supply current in Power-down Mode ICC_LOW ICC_HIGH IQ_LOW IQ_HIGH IREF ICONT IPD ACP1LOW 1.25 MHz offset ACP1HIGH Adjacent Channel Power (2)(3) ACP3LOW 2.25 MHz offset ACP3HIGH Harmonic Suppression Noise Power in RX Band 1930-1990 MHz Noise Figure Input Voltage Standing Wave Ratio Stability (Spurious output) Ruggedness - No damage (4) Second Third FO2 FO3 RxBN NF VSWR S Ru Condition VCONT = 2.5 V PO = 16 dB VCONT = 0.5 V PO = 29 dBm VCONT = 2.5 V PO = 16 dB VCONT = 0.5 V PO = 29 dBm PO = 16 dBm PO = 29 dBm VCONT = 2.5 V VCONT = 0.5 V -- VCONT = 2.5 V VCC = 3.4 V VREF = 0 V VCONT = 2.5 V PO = 16 dB VCONT = 0.5 V PO = 29 dBm VCONT = 2.5 V PO = 16 dB VCONT = 0.5 V PO = 29 dBm PO 29 dBm PO 29 dBm PO 29 dBm -- -- 5:1 VSWR All phases PO 29 dBm Minimum 24.0 27.0 7.0 37.0 -- -- 35 80 -- -- -- -- -- -- -- -- -- -- -- -- -- 10:1 Typical 25.0 28.5 8.5 40.0 135 580 50 95 6.0 140 3.0 -50 -51 -68 -60 -35 -55 -136 5.5 -- -- -- Maximum 26.3 dB 30.0 -- % -- 160 625 65 115 10.0 250 4.0 -48 -49 dBc -60 -57 -32 -40 -135 6.0 2.0:1 -65 -- dBm/Hz dB -- dBc VSWR dBc mA A A mA mA Unit
(1) VCC = +3.4 V, VREF = +2.85 V, Freq = 1880 MHz, TC = 25 C, unless otherwise specified (2) ACP is specified per IS95 as the ratio of the total in-band power (1.23 MHz BW) to adjacent power in a 30 kHz BW. (3) CDMA2000 is configured as DCHH = 9600, SCHO = 9600, PCH (Walsh 0) = -3.75 dB, and Peak-to-Average Ratio (CCDF = 1%) = 4.45 dB. For CDMA2000, back off output power 0.5 dB is required. (4) All phases, time = 10 seconds.
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DATA SHEET * CX77112
PA MODULE FOR CDMA PCS (1850-1910 MHZ)
Table 5. Electrical Specifications for CDMA Recommended Operating Conditions (1)
Characteristics Symbol GLOW Gain conditions Digital Mode GHIGH ACP1LOW 1.25 MHz offset ACP1HIGH Adjacent Channel Power (2)(3)(4) ACP3LOW 2.25 MHz offset ACP3HIGH Harmonic Suppression Noise Power in RX Band 1840-1895 MHz Noise Figure Input Voltage Standing Wave Ratio (VSWR) Stability (Spurious output) Ruggedness - No damage (5)
(1) Per Table 2, unless otherwise specified. (2) ACP is specified per IS95 as the ratio of the total in-band power (1.23 MHz BW) to adjacent power in a 30 kHz BW. (3) CDMA2000 is configured as DCCH = 9600, SCHO = 9600, PCH (Walsh 0) = -3.75 dB, and Peak-to-Average Ratio (CCDF = 1%) = 4.5 dB. For CDMA2000, back off output power 0.5 dB is required. (4) Worst case ACPR is -43 dBc at +85 C, VCC = 3.2 V. (5) All phases, time = 10 seconds.
Condition VCONT = 2.5 V PO = 16 dBm VCONT = 0.5 V PO = 29 dBm VCONT = 2.5 V PO 16 dBm VCONT = 0.5 V PO 29 dBm VCONT = 2.5 V PO 16 dBm VCONT = 0.5 V PO 29 dBm PO 29 dBm PO 29 dBm PO 29 dBm -- -- 5:1 VSWR All phases PO 29 dBm
Minimum 21.0 24.5 -- --
Maximum 29.0
Unit
dB 33.0 -44 -43 dBc -- -- -- -- -- -- -- -- 10:1 -56 -56 -30 -40 -132.0 7.0 2.5:1 -65.0 -- dBm/Hz dB -- dBc VSWR dBc
Second Third
FO2 FO3 RxBN NF VSWR S Ru
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PA MODULE FOR CDMA PCS (1850-1910 MHZ)
DATA SHEET * CX77112
Characterization Data
The following graphs illustrate the characteristics of a typical CX77112 Power Amplifier Module designed for operation in the PCS frequency band (1850-1910 MHz). This amplifier was selected by characterizing a group of devices and choosing a part with average electrical performance for both nominal and the full range of recommended operating conditions, including worst case limits. Figure 2 through Figure 8 illustrate the digital signal characteristics of the CX77112. Shown are power sweep characteristics for key performance parameters over temperature and frequency, up to 28.5 dBm output power. The data was taken up to and including 16 dBm output power with the bias mode control pin setting of VCONT = 2.5 volts. Beyond 16 dBm output power, the VCONT was set to 0 volts.
Figure 2. Digital Mode Gain vs. Output Power
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DATA SHEET * CX77112
PA MODULE FOR CDMA PCS (1850-1910 MHZ)
Figure 3. Primary Bias Current vs. Output Power
Figure 4. Power Added Efficiency vs. Output Power
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PA MODULE FOR CDMA PCS (1850-1910 MHZ)
DATA SHEET * CX77112
Figure 5. Adjacent Channel Power for 1.25 MHz Offset vs. Output Power
Figure 6. Adjacent Channel Power for 2.25 MHz Offset vs. Output Power
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DATA SHEET * CX77112
PA MODULE FOR CDMA PCS (1850-1910 MHZ)
Figure 7. Second Harmonic Rejection vs. Output Power
Figure 8. Third Harmonic Rejection vs. Output Power
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PA MODULE FOR CDMA PCS (1850-1910 MHZ)
DATA SHEET * CX77112
Evaluation Board Description
The evaluation board is a platform for testing and interfacing design circuitry. To accommodate the interface testing of the CX77112, the evaluation board schematic and diagrams are included for preliminary analysis and design. Figure 9 shows the basic schematic of the board for the 1850 MHz to 1910 MHz range.
Figure 9. Evaluation Board Schematic
Figure 10. Evaluation Board Assembly Diagram
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DATA SHEET * CX77112
PA MODULE FOR CDMA PCS (1850-1910 MHZ)
Package Dimensions and Pin Descriptions
The CX77112 is a multi-layer laminate base, overmold encapsulated modular package designed for surface mount solder attachment to a printed circuit board. Figure 11 is a mechanical drawing of the pad layout for this package. Figure 12 provides a recommended phone board layout footprint for the PAM to help the designer attain optimum thermal conductivity, good grounding, and minimum RF discontinuity for the 50-ohm terminals. Figure 13 illustrates the pin configuration and numbering convention, which starts with pin 1 in the upper left and increments counter-clockwise around the package. Table 6 describes each pin function. Figure 14 shows typical case markings.
Figure 11. CX77112 Package Drawing
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PA MODULE FOR CDMA PCS (1850-1910 MHZ)
DATA SHEET * CX77112
Figure 12. Phone PCB Layout Footprint for 4 x 4 mm, 10-Pin Package - CX77112
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DATA SHEET * CX77112
PA MODULE FOR CDMA PCS (1850-1910 MHZ)
Table 6. CX77112 Pin Configuration and Descriptions
PIN Number 1 2 3 4 5 6 7 8 9 10 GND PAD
(1) (2)
Package and Handling Information
Because of its sensitivity to moisture absorption, this device package is baked and vacuum-packed prior to shipment. Instructions on the shipping container label must be followed regarding exposure to moisture after the container seal is broken, otherwise, problems related to moisture absorption may occur when the part is subjected to high temperature during solder assembly. The CX77112 is capable of withstanding an MSL3/240 C solder reflow. Care must be taken when attaching this product, whether it is done manually or in a production solder reflow environment. If the part is attached in a reflow oven, the temperature ramp rate should not exceed 5 C per second; maximum temperature should not exceed 240 C. If the part is manually attached, precaution should be taken to insure that the part is not subjected to temperatures exceeding 240 C for more than 10 seconds. For details on attachment techniques, precautions, and handling procedures recommended by Skyworks, please refer to Skyworks Application Note: PCB Design and SMT Assembly/Rework, Document Number 101752. Additional information on standard SMT reflow profiles can also be found in the JEDEC Standard J-STD-020. Production quantities of this product are shipped in the standard tape-and-reel format. For packaging details, refer to Skyworks Application Note: Tape and Reel Information -RF Modules, Document Number 101568.
Function VCC1 (1) RF IN GND VCONT VREF GND GND RF OUT GND VCC2 (1) GND (2)
Description Connect to battery or DC supply RF Input Ground Control voltage Reference voltage Ground Ground RF Output Ground Connect to battery or DC supply Ground pad on underside of package
All supply pins may be connected together at the supply. Package underside is GND.
Electrostatic Discharge Sensitivity
The CX77112 is a Class 2 device. Figure 15 lists the Electrostatic Discharge (ESD) immunity level for each non-ground pin of the CX77112 product. ESD testing was performed in compliance with MIL-STD-883E Method 3015.7 using the Human Body Model. The numbers in Figure 15 specify the ESD threshold level for each pin where the I-V curve between the pin and ground starts to show degradation. Various failure criteria can be utilized when performing ESD testing. Many vendors employ relaxed ESD failure standards that fail devices only after "the pin fails the electrical specification limits" or "the pin becomes completely non-functional". Skyworks employs most stringent criteria to fail devices as soon as the pin begins to show any degradation on a curve tracer. If ESD damage threshold magnitude is found to consistently exceed 2000 volts on a given pin, this so is indicated. If ESD damage threshold below 2000 volts is measured for either polarity, numbers are indicated that represent worst case values observed in product characterization.
Figure 13. CX77112 Pin Configuration
Figure 14. Typical Case Markings
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PA MODULE FOR CDMA PCS (1850-1910 MHZ)
DATA SHEET * CX77112
* Personnel Grounding - Wrist Straps - Conductive Smocks, Gloves and Finger Cots - Antistatic ID Badges * Facility - Relative Humidity Control and Air Ionizers - Dissipative Floors (less than 109 to GND) * Protective Workstation - Dissipative Table Tops - Protective Test Equipment (Properly Grounded) - Grounded Tip Soldering Irons - Conductive Solder Suckers - Static Sensors
Figure 15. CX77112 ESD Sensitivity Areas (Top View)
To avoid ESD damage, both latent and visible, it is very important that the product assembly and test areas observe these Class 2 ESD handling precautions for GaAs IC-based products to avoid induced damage.
* Protective Packaging & Transportation - Bags and Pouches (Faraday Shield) - Protective Tote Boxes (Conductive Static Shielding) - Protective Trays - Grounded Carts - Protective Work Order Holders
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Skyworks Ordering Information
Model Number CX77112 Manufacturing Part Number CX77112 Product Revision Package 4x4LM-10 Operating Temperature -30 C to +85 C
Revision History
Revision A B C D E F Level Date June 17, 2003 July 14, 2003 August 22, 2003 November 25, 2003 May 19, 2004 June 1, 2005 Initial Release Revise: Table 2, 3, 4, 5 Revise: Table 1 Revise: Table 5 Revise: Figure 1 Add: Figure 12 Description
References
Application Note: PCB Design and SMT Assembly/Rework, Document Number 101752. Application Note: Tape and Reel, Document Number 101568. JEDEC Standard J-STD-020
(c) 2001-2005, Skyworks Solutions, Inc. All Rights Reserved. Information in this document is provided in connection with Skyworks Solutions, Inc. ("Skyworks") products. These materials are provided by Skyworks as a service to its customers and may be used for informational purposes only. Skyworks assumes no responsibility for errors or omissions in these materials. Skyworks may make changes to its products, specifications and product descriptions at any time, without notice. Skyworks makes no commitment to update the information and shall have no responsibility whatsoever for conflicts, incompatibilities, or other difficulties arising from future changes to its products and product descriptions. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document. Except as may be provided in Skyworks' Terms and Conditions of Sale for such products, Skyworks assumes no liability whatsoever. THESE MATERIALS ARE PROVIDED "AS IS" WITHOUT WARRANTY OF ANY KIND, EITHER EXPRESS OR IMPLIED, RELATING TO SALE AND/OR USE OF SKYWORKSTM PRODUCTS INCLUDING WARRANTIES RELATING TO FITNESS FOR A PARTICULAR PURPOSE, MERCHANTABILITY, PERFORMANCE, QUALITY OR NON-INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT. SKYWORKS FURTHER DOES NOT WARRANT THE ACCURACY OR COMPLETENESS OF THE INFORMATION, TEXT, GRAPHICS OR OTHER ITEMS CONTAINED WITHIN THESE MATERIALS. SKYWORKS SHALL NOT BE LIABLE FOR ANY SPECIAL, INDIRECT, INCIDENTAL, OR CONSEQUENTIAL DAMAGES, INCLUDING WITHOUT LIMITATION, LOST REVENUES OR LOST PROFITS THAT MAY RESULT FROM THE USE OF THESE MATERIALS. SkyworksTM products are not intended for use in medical, lifesaving or life-sustaining applications. Skyworks' customers using or selling SkyworksTM products for use in such applications do so at their own risk and agree to fully indemnify Skyworks for any damages resulting from such improper use or sale. The following are trademarks of Skyworks Solutions, Inc.: SkyworksTM, the Skyworks symbol, and "Breakthrough Simplicity"TM. Product names or services listed in this publication are for identification purposes only, and may be trademarks of third parties. Third-party brands and names are the property of their respective owners. Additional information, posted at www.skyworksinc.com, is incorporated by reference.

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